发明Composites of powdered fillers and polymer matrix

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申请号 US19990345813D 申请日 1999年07月02日 最早公开日 2002年04月04日 所属国家/地区 美国
公开号及公开日 US2002038582A1   2002年04月04日
US6391082B1   2002年05月21日
授权日 2002年05月21日 说明书附图
申请人 HOLL RICHARD A. (美国)  
发明人 HOLL RICHARD A  
优先权 US19990345813   19990702
专利分类号 C08J3/20   B01F13/10   B22F3/20   B22F3/22   B29B7/40   B29B7/90   B29C47/00   B29C47/50   B29C67/24   B29C70/58   C08J5/00   C08K3/00   C08K7/24   C08L71/12   C22C32/00   H01L23/14   H01L23/29   H01L23/31   H05K1/03   H05K3/02  
代理机构 代理人
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名称及摘要

粉末填充物和聚合物粘合剂的复合材料及其制备方法
一种复合材料,其中包含体积含量至少为60%、最好为70%的制成细粉末的填充物,将该填料粉末均匀掺杂在聚乙烯(亚芳基醚)聚合物粘合剂中,形成混合物并制成特定形状,然后给该混合物施加足够高的温度令聚合物材料熔化,同时施加足够大的压力,令熔化的聚合物均匀分散在填料微粒缝隙之间。一个意外收获是:要想所述聚合物真正成为有效的粘合剂,所加入的固体填料的含量必须达到上述特定比例,低于该含量则所制成的成品易于脆裂;这一发现与现有技术刚好相反,过去认为随着所加入的固体填料的含量的增加,复合材料的强度将逐步降低,因此必须限制该固体填料的含量。为了将混合物中各种成分混合到足够的均匀程度,所述混合物各原料分别在各自的液态离散媒介中进行混合,其中聚合物内还包括有必要的添加剂,为了获得要求的微粒尺寸,可以分别对每种混合原料进行研磨,然后将它们混合,并再次进行搅拌研磨,令其实现完全均匀分布,继而将混合物与液态离散剂分离,由粘糊状混合材料制成坯料,再对该坯料进行热压处理。为达到最后的制成品所要求的化学和物理组合特性,填料可以是由多种成分混和而成,该制成品可以用来制造电子电路基底产品。
Composites of powdered fillers and polymer matrix
Composite materials comprising at least 60 volume %, preferably 70 volume %, of particles of finely powdered filler material in a matrix of poly(arylene ether) polymer material are made by forming a mixture of the components, forming the required bodies therefrom, and then heating and pressing the bodies to a temperature sufficient to melt the polymer and to a pressure sufficient to disperse the melted polymer into the interstices between the filler particles. Surprisingly these polymer materials can only be effective as bonding materials when the solids content is as high as that specified, since with lower contents the resultant bodies are too friable. This is completely contrary to accepted prior art practice which considers that composites are progressivly weakened as the solids content is increased, so that such content must be limited. In processes to obtain as complete a dispersion of the components as possible they are individually dispersed in a liquid dispersion medium containing the polymer together with necessary additives, each mixture being ground if required to obtain a desired particle size, the mixtures are mixed, again ground to produce thorough dispersion, are separated from the liquid dispersion medium and green articles formed from the resulting pasty mixture. The green articles are then heated and pressed as described above. Mixtures of different filler materials may be used to tailor the electrical and physical properties of the final materials. The articles preferably comprise substrates for use in electronic circuits.

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