发明Low defect density silicon and a process for producing low defect density silicon wherein V/G0 is controlled by controlling heat transfer at the melt/solid interface

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著录项目

申请号 US20010833777 申请日 2001年04月12日 最早公开日 2001年09月13日 所属国家/地区 美国
公开号及公开日 授权日 2002年06月25日 说明书附图
申请人 FALSTER ROBERT J. (英国)  
HOLZER JOSEPH C. (美国)  
发明人 FALSTER ROBERT J   HOLZER JOSEPH C  
优先权 US19970041845P   19970409US19980057907   19980409US20010833777   20010412
专利分类号 C30B29/06   C30B15/00   C30B15/14   C30B15/20   C30B15/22   C30B21/06   C30B27/02   C30B28/10   C30B30/04   C30B33/00   H01L21/322   H01L21/324  
代理机构 代理人 Array  

名称及摘要

低缺陷密度硅以及一种工艺,用于生产低缺陷密度硅,其中 V / g0 控制控制传热熔体/固体界面处
本发明涉及单晶硅,呈锭或晶片的形式,其包含轴向对称区域,其没有聚合的本征点缺陷,以及一种工艺,用于及其制备。 过程包括控制生长条件,例如生长速度, V ,瞬时轴热梯度, g0 ,以及冷却速度,在温度范围至,其硅自间隙是移动,为了防止形成这些聚合的缺陷。 呈锭的形式,轴向对称区域具有一宽度,测量的从圆周边缘锭径向朝着主轴线,其至少约30%长度晶锭半径。 轴向对称区域还具有一个长度,测量的沿主轴线,其是至少20%长度恒定直径的晶锭的部分。
Low defect density silicon and a process for producing low defect density silicon wherein V/G0 is controlled by controlling heat transfer at the melt/solid interface
The present invention relates to single crystal silicon, in ingot or wafer form, which contains an axially symmetric region which is free of agglomerated intrinsic point defects, and a process for the preparation thereof. The process including controlling growth conditions, such as growth velocity, v, instantaneous axial temperature gradient, G0, and the cooling rate, within a range of temperatures at which silicon self-interstitials are mobile, in order to prevent the formation of these agglomerated defects. The control of G0 is accomplished by controlling heat transfer at the melt/solid interface.

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2001年06月05日 us_oipe (更多信息: Application Dispatched from OIPE , OIPE)
2001年06月15日 us_a.pe (更多信息: Preliminary Amendment , A.PE)
2001年06月15日 us_dock (更多信息: Case Docketed to Examiner in GAU , DOCK)
2001年07月11日 us_wids (更多信息: Information Disclosure Statement (IDS) Filed , WIDS)
2001年07月11日 us_m844 (更多信息: Information Disclosure Statement (IDS) Filed , M844)
2001年08月13日 us_ctnf (更多信息: Non-Final Rejection , CTNF)
2001年08月14日 us_mctnf (更多信息: Mail Non-Final Rejection , MCTNF)
2001年10月16日 us_wids (更多信息: Information Disclosure Statement (IDS) Filed , WIDS)
2001年10月16日 us_dist (更多信息: Terminal Disclaimer Filed , DIST)
2001年10月16日 us_a... (更多信息: Response after Non-Final Action , A...)
2001年10月16日 us_m844 (更多信息: Information Disclosure Statement (IDS) Filed , M844)
2001年10月25日 us_fwdx (更多信息: Date Forwarded to Examiner , FWDX)
2001年10月29日 us_disq (更多信息: Terminal Disclaimer Approved in TC , DISQ)
2001年11月21日 us_as 转让(新专利权人: CITICORP USA,INC.,DELAWARE
更多信息: SECURITY AGREEMENT;ASSIGNORS:MEMC PASADENA,INC.;PLASMASIL,L.L.C.;SIBOND,L.L.C.;AND OTHERS;REEL/FRAME:012280/0161
生效日期: 20011113)
2001年11月21日 us_as 转让(新专利权人: MEMC ELECTRONIC MATERIALS,INC.,MISSOURI
更多信息: TERMINATION OF SECURITY INTEREST;ASSIGNOR:E.ON AG;REEL/FRAME:012263/0944
生效日期: 20011113)
2001年11月21日 us_as 转让(新专利权人: CITICORP USA,INC.,DELAWARE
更多信息: SECURITY INTEREST;ASSIGNORS:MEMC PASADENA,INC.;PLASMASIL,L.L.C.;SIBOND,L.L.C.;AND OTHERS;REEL/FRAME:012273/0145
生效日期: 20011113)
2001年12月27日 us_as 转让(新专利权人: E. ON AG,GERMANY
更多信息: SECURITY INTEREST;ASSIGNOR:MEMC ELECTRONIC MATERIALS,INC.;REEL/FRAME:012407/0806
生效日期: 20011025)
2001年12月28日 us_as 转让(新专利权人: CITICORP USA,INC.,DELAWARE
更多信息: SECURITY AGREEMENT;ASSIGNORS:MEMC PASADENA,INC.;PLASMASIL,L.L.C.;SIBOND,L.L.C.;AND OTHERS;REEL/FRAME:012365/0345
生效日期: 20011221)
2001年12月30日 us_n/dr (更多信息: Formal Drawings Required , N/DR)
2001年12月30日 us_n/=. (更多信息: Notice of Allowance Data Verification Completed , N/=.)
2001年12月30日 us_dock (更多信息: Case Docketed to Examiner in GAU , DOCK)
2001年12月31日 us_mn/=. (更多信息: Mail Notice of Allowance , MN/=.)
2001年12月31日 us_mn/dr (更多信息: Mail Formal Drawings Required , MN/DR)
2002年01月03日 us_d1220 (更多信息: Dispatch to Publications , D1220)
2002年01月04日 us_sent (更多信息: Workflow - File Sent to Contractor , SENT)
2002年01月04日 us_r1021 (更多信息: Receipt into Pubs , R1021)
2002年03月22日 us_n084 (更多信息: Issue Fee Payment Verified , N084)
2002年03月22日 us_drwf (更多信息: Workflow - Drawings Finished , DRWF)
2002年03月22日 us_drwm (更多信息: Workflow - Drawings Matched with File at Contractor , DRWM)
2002年03月22日 us_ltdr (更多信息: Incoming Letter Pertaining to the Drawings , LTDR)
2002年03月22日 us_drwi (更多信息: Workflow - Drawings Received at Contractor , DRWI)
2002年03月22日 us_drwr (更多信息: Workflow - Drawings Sent to Contractor , DRWR)
2002年03月22日 us_r85b (更多信息: Workflow -Received 85b - Unmatched , R85B)
2002年03月22日 us_ifee (更多信息: Issue Fee Payment Received , IFEE)
2002年03月27日 us_r1021 (更多信息: Receipt into Pubs , R1021)
2002年05月15日 us_pils (更多信息: Application Is Considered Ready for Issue , PILS)
2002年05月15日 us_r1021 (更多信息: Receipt into Pubs , R1021)
2002年05月17日 us_r1021 (更多信息: Receipt into Pubs , R1021)
2002年06月06日 us_wpir (更多信息: Issue Notification Mailed , WPIR)
2002年06月25日 us_pgm/ (更多信息: Recordation of Patent Grant Mailed , PGM/)
2002年06月25日 us_ptac (更多信息: Patent Issue Date Used in PTA Calculation , PTAC)
2002年09月10日 us_n423 (更多信息: Post Issue Communication - Certificate of Correction , N423)
2002年10月08日 us_cc 更正的证书()
2003年03月19日 us_as 转让(新专利权人: CITICORP USA,INC.,DELAWARE
更多信息: SECURITY AGREEMENT;ASSIGNORS:MEMC ELECTRONIC MATERIALS,INC.;MEMC PASADENA,INC.;PLASMASIL,L.L.C.;AND OTHERS;REEL/FRAME:013964/0378;SIGNING DATES FROM 20020303 TO 20030303)
2005年08月11日 us_as 转让(新专利权人: MEMC ELECTRONIC MATERIALS,INC.,MISSOURI
更多信息: RELEASE OF SECURITY INTEREST;ASSIGNOR:CITICORP USA,INC.;REEL/FRAME:016641/0045
生效日期: 20050602)
2006年01月11日 us_remi 邮寄的维持费提醒单()
2006年01月19日 us_fpay 缴费(付费年限: 4)
2006年01月19日 us_sulp 逾期付款的附加费()
2008年06月06日 us_pa.. (更多信息: Change in Power of Attorney (May Include Associate POA) , PA..)
2008年06月06日 us_c.ad (更多信息: Correspondence Address Change , C.AD)
2009年09月23日 us_fpay 缴费(付费年限: 8)
2011年04月01日 us_as 转让(新专利权人: BANK OF AMERICA,N.A.,MASSACHUSETTS
更多信息: SECURITY AGREEMENT;ASSIGNORS:MEMC ELECTRONIC MATERIALS,INC.;SUNEDISON LLC;SOLAICX;REEL/FRAME:026064/0720
生效日期: 20110317)
2012年10月01日 us_as 转让(新专利权人: GOLDMAN SACHS BANK USA,NEW JERSEY
更多信息: SECURITY AGREEMENT;ASSIGNORS:NVT,LLC;SUN EDISON LLC;SOLAICX,INC.;AND OTHERS;REEL/FRAME:029057/0810
生效日期: 20120928)
2013年12月09日 us_fpay 缴费(付费年限: 12)
2013年12月26日 us_as 转让(新专利权人: ENFLEX CORPORATION,CALIFORNIA
更多信息: RELEASE BY SECURED PARTY;ASSIGNOR:BANK OF AMERICA,N.A.;REEL/FRAME:031870/0031
生效日期: 20131220)
2013年12月26日 us_as 转让(新专利权人: NVT,LLC,CALIFORNIA
更多信息: RELEASE BY SECURED PARTY;ASSIGNOR:GOLDMAN SACHS BANK USA;REEL/FRAME:031870/0092
生效日期: 20131220)
2013年12月26日 us_as 转让(新专利权人: SUNEDISON,INC. (F/K/A MEMC ELECTRONIC MATERIALS,
更多信息: RELEASE BY SECURED PARTY;ASSIGNOR:BANK OF AMERICA,N.A.;REEL/FRAME:031870/0031
生效日期: 20131220)
2013年12月26日 us_as 转让(新专利权人: SUNEDISON,INC. (F/K/A MEMC ELECTRONIC MATERIALS,
更多信息: RELEASE BY SECURED PARTY;ASSIGNOR:GOLDMAN SACHS BANK USA;REEL/FRAME:031870/0092
生效日期: 20131220)
2013年12月26日 us_as 转让(新专利权人: SUN EDISON LLC,CALIFORNIA
更多信息: RELEASE BY SECURED PARTY;ASSIGNOR:GOLDMAN SACHS BANK USA;REEL/FRAME:031870/0092
生效日期: 20131220)
2013年12月26日 us_as 转让(新专利权人: SOLAICX,OREGON
更多信息: RELEASE BY SECURED PARTY;ASSIGNOR:BANK OF AMERICA,N.A.;REEL/FRAME:031870/0031
生效日期: 20131220)
2013年12月26日 us_as 转让(新专利权人: SOLAICX,OREGON
更多信息: RELEASE BY SECURED PARTY;ASSIGNOR:GOLDMAN SACHS BANK USA;REEL/FRAME:031870/0092
生效日期: 20131220)
2013年12月26日 us_as 转让(新专利权人: SUN EDISON LLC,CALIFORNIA
更多信息: RELEASE BY SECURED PARTY;ASSIGNOR:BANK OF AMERICA,N.A.;REEL/FRAME:031870/0031
生效日期: 20131220)
2014年01月30日 us_as 转让(新专利权人: DEUTSCHE BANK AG NEW YORK BRANCH,NEW JERSEY
更多信息: SECURITY AGREEMENT;ASSIGNORS:SUNEDISON,INC.;SOLAICX;SUN EDISON,LLC;AND OTHERS;REEL/FRAME:032177/0359
生效日期: 20140115)
2014年03月03日 us_as 转让(新专利权人: SUN EDISON LLC,CALIFORNIA
更多信息: RELEASE BY SECURED PARTY;ASSIGNOR:DEUTSCHE BANK AG NEW YORK BRANCH;REEL/FRAME:032382/0724
生效日期: 20140228)
2014年03月03日 us_as 转让(新专利权人: SUNEDISON,INC.,MISSOURI
更多信息: RELEASE BY SECURED PARTY;ASSIGNOR:DEUTSCHE BANK AG NEW YORK BRANCH;REEL/FRAME:032382/0724
生效日期: 20140228)
2014年03月03日 us_as 转让(新专利权人: NVT,LLC,MARYLAND
更多信息: RELEASE BY SECURED PARTY;ASSIGNOR:DEUTSCHE BANK AG NEW YORK BRANCH;REEL/FRAME:032382/0724
生效日期: 20140228)
2014年03月03日 us_as 转让(新专利权人: SOLAICX,OREGON
更多信息: RELEASE BY SECURED PARTY;ASSIGNOR:DEUTSCHE BANK AG NEW YORK BRANCH;REEL/FRAME:032382/0724
生效日期: 20140228)
2014年03月17日 us_as 转让(新专利权人: SIBOND,L.L.C.,MISSOURI
更多信息: RELEASE OF SECURITY INTEREST TO REEL/FRAME: 012280/0161;ASSIGNOR:CITICORP USA,INC.;REEL/FRAME:032458/0794
生效日期: 20140313)
2014年03月17日 us_as 转让(新专利权人: MEMC PASADENA,INC.,TEXAS
更多信息: RELEASE OF SECURITY INTEREST TO REEL/FRAME: 012280/0161;ASSIGNOR:CITICORP USA,INC.;REEL/FRAME:032458/0794
生效日期: 20140313)
2014年03月17日 us_as 转让(新专利权人: MEMC ELECTRONIC MATERIALS,INC. (NOW KNOWN AS SUNE
更多信息: RELEASE OF SECURITY INTEREST TO REEL/FRAME: 012280/0161;ASSIGNOR:CITICORP USA,INC.;REEL/FRAME:032458/0794
生效日期: 20140313)
2014年03月17日 us_as 转让(新专利权人: PLASMASIL,L.L.C.,MISSOURI
更多信息: RELEASE OF SECURITY INTEREST TO REEL/FRAME: 012280/0161;ASSIGNOR:CITICORP USA,INC.;REEL/FRAME:032458/0794
生效日期: 20140313)
2014年03月17日 us_as 转让(新专利权人: MEMC SOUTHWEST INC.,MISSOURI
更多信息: RELEASE OF SECURITY INTEREST TO REEL/FRAME: 012280/0161;ASSIGNOR:CITICORP USA,INC.;REEL/FRAME:032458/0794
生效日期: 20140313)
2014年03月17日 us_as 转让(新专利权人: MEMC INTERNATIONAL,INC. (NOW KNOWN AS SUNEDISON I
更多信息: RELEASE OF SECURITY INTEREST TO REEL/FRAME: 012280/0161;ASSIGNOR:CITICORP USA,INC.;REEL/FRAME:032458/0794
生效日期: 20140313)
2014年05月27日 us_as 转让(新专利权人: SUNEDISON SEMICONDUCTOR LIMITED (UEN201334164H),S
更多信息: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNOR:MEMC ELECTRONIC MATERIALS,INC.;REEL/FRAME:033023/0430
生效日期: 20140523)
2014年06月06日 us_as 转让(新专利权人: SUNEDISON SEMICONDUCTOR TECHNOLOGY PTE. LTD.,MISS
更多信息: NOTICE OF LICENSE AGREEMENT;ASSIGNOR:SUNEDISON SEMICONDUCTOR LIMITED;REEL/FRAME:033099/0001
生效日期: 20140527)

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2014年06月20日